New Microfluidics Module enables study of microfluidic devices and Users to initiate a change of the CAD geometry from the COMSOL model. The LiveLink interface is also bidirectional, allowing Such as physics or mesh settings, are retained after subsequent This means that settings applied to the geometry, Geometry in the COMSOL model stays associative with the CAD geometry in With the new LiveLink for AutoCAD users can transfer a 3D geometry fromĪutoCAD to COMSOL Multiphysics. Multiphysics simulation in a tightly integrated environment. New LiveLink for SpaceClaim interface fuses direct modeling and Interface where a SolidWorks user can stay inside of the SolidWorksĮnvironment and work synchronously with COMSOL Multiphysics. LiveLink for SolidWorks® interface has been extended with a One Window Plots for frequency response studies, and ribbon plots for flows. New plot types include histogram plots for statistical analysis, Nyquist In the Model Builder, default plots areĬustomized to adapt to the physics in the model with descriptive names. Drag-and-drop is now supported in the Model Builder tree to Important data in a well-organized, easy-to-read format.ĬOMSOL Desktop with the Model Builder was first introduced with VersionĤ.0. Several reportsĬan be added to a single model, enabling users to communicate all their Of varying degrees of detail, from brief to complete. Integrated, customizable tool lets users create data-rich HTML reports Report Generator for publishing results data. Version 4.2, COMSOL has responded to customers requests with a new Mixer and 164% increase for a microfluidic lab-on-a-chip simulation.” “Benchmark tests indicate a speed-up of 425% for a laminar flow static Says Bjorn Sjodin, Vice president of product management with COMSOL. Parallelized assembly means that a lot of users get a lot of speed,” With Version 4.2, the multiphysics assembly algorithmsĪnd iterative solvers have now also been parallelized. The picture shows a vibrating baffled membrane and the sound pressure level (dB) in the air that surrounds it.ĬOMSOL direct solvers have been multicore and cluster-enabled for This is especiallyĬrucial for importing topographical data for earth science applications.Ī new multiphysics interface for Acoustic-Shell Interaction enables modeling of vibrating thin elastic structures and their induced sound pressure field. On analytical expressions or look-up table data. New Parametric Surfaces feature allows for creation of surfaces based Models with moving diffusionįronts are solved more efficiently as are simulations involving removal Meshing and automatic remeshing tightly link solvers and meshingĪlgorithms for any moving mesh analysis. Identifies the essential parts of the original CAD model to enableįaster and more memory efficient solving. The impact is primarily on what is already aĤ.2 includes new virtual geometry tools for creating a mesh that New capabilities target geometry, mesh, and The result is improved and expanded multiphysics simulation To this release are the core development initiatives undertaken byĬOMSOL. The company has improved the solver technologies across the software – and new LiveLink interfaces for AutoCAD and SpaceClaim. “The implication, and what we’re delivering with 4.2, is anĮxpanded product offering based on that platform.”Ĥ.2 expands the applications covered by COMSOL with three newĪpplication modules – Microfluidics, Geomechanics, and Electrodeposition To reach broader audiences,” says Svante Littmarck, President and CEO ofĬOMSOL. Vision behind Version 4 was to provide a foundation for our customers Version 4.2, which expands the scope ofĪpplications covered by COMSOL, is now available and will be shipped toĪll customers with current subscriptions. released the latest version of COMSOL Multiphysics, This model shows the new Microfluidics Module being used to model free molecular flow inside a semiconductor ion implanter, demonstrating that COMSOL can be used in the design process to minimize the pressure along the ion beam path.
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